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NSR0130M2T5G
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3
PACKAGE DIMENSIONS
SOD?723
CASE 509AA?01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
DIM MIN NOM MAX
MILLIMETERS
A
0.49 0.52 0.55
b
0.25 0.28 0.32
c
0.08 0.12 0.15
D
0.95 1.00 1.05
E
HE
0.55 0.60 0.65
1.35 1.40 1.45
L
0.15 0.20 0.25
0.019 0.020 0.022
0.0098 0.011 0.013
0.0032 0.0047 0.0059
0.037 0.039 0.041
0.022 0.024 0.026
0.053 0.055 0.057
0.006 0.0079 0.010
MIN NOM MAX
INCHES
D
E
b
2X
c
A
L
?Y?
?X?
0.08 (0.0032)
XY
HE
0.45
0.0177
0.50
0.0197
1.1
0.043
SCALE 10:1
mm
inches
SOD?723
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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e changes without further notice
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NSR0130/D
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